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JTG NEWS & INFO
Wellspring Announces Japan Technology Group as a Channel Partner for Japan Market
Wellspring Worldwide, the leader in software for technology transfer and corporate innovation management, today appointed Japan Technology Group (JTG) as a strategic channel partner in Japan.
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Contract to research and identify European industrial technologies of high cooperation and business potential for Japan.
Japan Technology Group as member of the International Consortium has been awarded a contract to research and identify European industrial technologies of high cooperation and business potential for Japan. Click to see full details...
JAPAN TECHNOLOGY GROUP, Inc. has signed a MOU with I-DEALS INNOVATION &
TECHNOLOGY VENTURING SERVICES, S.L.U ( everis Group, subsidiary of the NTT Data Group)
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University of Hawai‘i
Director Business Development, Office of the Vice President for Research and Innovation
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We have been working on bio-based/biodegradable flexible films for food packaging to help
achieve our sustainability goals of having 100% RCB compliance for our packages as well as
20% reduction in GHG by 2030.
While flexible package is a very sustainable option from a material use point of view, the multilayer
multi-material structures are not conducive for recycling and mostly end up in the landfill or
as litter. While the biodegradable films help us with the end of life issues by designing for
managed waste infrastructures like composting and anaerobic digestion, it cannot be at the
expense of performance compromises such as reduced shelf stability.
Oxygen barrier is not a problem with these films but achieving the very high moisture barrier
required for packaging dry foods (< 0.3 g/m2/day under tropical conditions of 38C/90% RH) has
been a challenge. We understand that metallization will be needed to achieve the high moisture
barrier requirements, but even with metallization we have not been able to reach this barrier with
bio-based films. Also, it is important to maintain this barrier under forming conditions in the VFFS
process of bag-making.
We are looking for novel resins that can be co-extruded with our core resins to form a skin layer
with high functionality that can anchor metal to film or highly functional coatings which would
serve the same purpose. Inherently high barrier coatings that can be applied as primer coating or
top coating over metal could also be a solution.
• Barrier skin resins should be co-extrudable with PLA/PHA resin in blown film or cast film
• The barrier skin layer should have good adhesion to core layer, or a suitable tie layer needs to
• The barrier resin should be biodegradable under home composting conditions at a minimum
• If barrier or metallization primer coating, it should be applicable on to our film by commercially
available roll coating processes
• Possible to metallize on top of skin layer or coating
• The ideal solution would have all the Must Haves and all the Nice to Haves. Of the multiple
technologies that meet all the Must Haves (minimum requirement) the one that meets the most
Nice-to-Haves may be the best. Based on weighting factors the Nice to Have factors could be
used to prioritize similar solutions.
• The skin layer option is preferable as it enables avoiding a unit operation in the conversion
• Identification of barrier options (both skin or coating) which could help avoid metallization
would be ideal (stretch goal)
• Solvent-free coating technology is ideal from a GHG point of view but willing to try both waterbased
and even solvent-based technologies
• Recent advances in metallization with other metals like silicon etc. are welcome
Past Work And “Out Of Scope” List:
• Solvent cast film technologies would not be commercially available
• PGA, G-polymer as skin resins
• Nano-cellulose, nano-clay coatings but recent advances are welcome
• Preferred Collaboration Types
We are open to the following types of engagement:
sponsored research for development and proof of concept testing, consultation, licensing
existing technology for PEP to apply, purchase commercial ready solution, open to any,
or E-mail us at firstname.lastname@example.org.
Please specify which technology need(s) you are responding to.
No cost for submitting a proposal
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Japan Technology Group, Inc.
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